Editorial board

Editor

Jose Miguel Martín-Martínez - Universidad de Alicante, Spain

Associate Editors

Milan Sernek -  University of Ljubljana, Slovenia
Mutlu Ozcan - University of Zürich, Switzerland

Editorial Board

Akbar Heidarzadeh - Azarbaijan Shahid Madani University, Iran
Andrew Crocombe - University of Surrey, UK
Anna Guzanova - Technical University of Košice, Slovakia
Charles W. Paul - Henkel Adhesives
Chuck Extrand - Colder Products Company
Claudia Volpato - Universidade Federal de Santa Catarina, Brazil
Dhanesh G. Mohan - Zhengzhou Research Institute of Harbin Institute of Technology, China
Ebru Kavak Akpinar - Firat University, Department of Mechanical Engineering, Elazig, Turkey
Edward Bormashenko - Ariel University Center of Samaria
Husnu Gerengi - Duzce University, Turkey
Ime Bassey Obot - King Fahd University of Petroleum and Minerals
Iulian Antoniac - University Politehnica of Bucharest
Jorg Friedrich - Technische Universität Berlin
Lei Guo - Tongren University, China
Luca Goglio - Politecnico di Torino, Italy
M Luisa Gonzalez Martin - University of Extremadura, Spain
Madani Bederina - University Amar Telidji, Algeria
Marco Alfano - University of Calabria, Italy
Mirta Aranguren - University of Mar del Plata–National Research Council for Science and Technology (CONICET)
Mustafa Apalak - Erciyes University, Turkey
Raul D.S.G. Campilho - Instituto Superior de Engenharia do Porto, Portugal
Safa Tuncer - Istanbul University, Turkey
Saviour Umoren - King Fahd University of Petroleum and Minerals, Saudi Arabia
V. Duma - Aurel Vlaicu University of Arad, Romania
Vladimir Cech - Brno University of Technology, Czech
Weilin Deng - Saint-Gobain Research North America, USA
Xiankang Zhong - Xi'an Jiaotong University, China
Xiao Han - Department of Engineering Mechanics, Dalian University of Technology, China
Ya-Pu Zhao - Institute of Mechanics, Chinese Academy of Sciences, China
Husain Mehdi - Meerut Institute of Engineering and Technology, India
Anna Rudawska - Lublin University of Technology, Poland
Byung-Dae Park - Kyungpook National University, Republic of Korea
Liang He - Chongqing Jiaotong University, China
Chong Leong Gan - Micron Memory Taiwan Co., Taiwan