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Conference Proceeding Papers

C60 nanocrystals thin film with controlled density

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Figures & data

Figure 1. Schematic of liquid-liquid interface assembly technique in this study.

Figure 1. Schematic of liquid-liquid interface assembly technique in this study.

Figure 2. SEM images of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.

Figure 2. SEM images of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.

Figure 3. Coverage rate of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion.

Figure 3. Coverage rate of thin films fabricated by the liquid-liquid interface assembly technique using the C60 NCs dispersion.

Figure 4. The AFM images of fabricated thin films fabricated by liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.

Figure 4. The AFM images of fabricated thin films fabricated by liquid-liquid interface assembly technique using the C60 NCs dispersion. The deposition times were (a) 1 time, (b) 2 times, (c) 3 times and (d) 4 times and baked at 120 °C for 20 min.

Figure 5. Average value of RMS fabricated thin films by liquid-liquid interface assembly technique using the C60 NCs dispersion.

Figure 5. Average value of RMS fabricated thin films by liquid-liquid interface assembly technique using the C60 NCs dispersion.

Figure 6. XRD spectra of thin film of ITO, pristine nanocrystals layer, nanocrystals layer non-baking and nanocrystals layer with baking.

Figure 6. XRD spectra of thin film of ITO, pristine nanocrystals layer, nanocrystals layer non-baking and nanocrystals layer with baking.