ABSTRACT
The present research aims to achieve a shape-stable, and leakage-proof material for thermal energy storage (TES). The leakage analysis of 20 wt.% SiO2@Cu PCM shows 0.05%, as a result, more testing is conducted to assess its morphology, structure, and thermal properties. TGA and DSC studies demonstrated that the latent heat and thermal degradation rate (TDR) has been delayed, with a significant decrease in latent heat of roughly 8.7% compared to pure paraffin. Laser Flash Method (LFA) results revealed that the thermal conductivity (TC) of the PCM composite significantly increased 4.84 times than the paraffin.
Acknowledgments
The authors express their gratefulness and acknowledge the Department of Physics, GBPUAT, Pantnagar, and Uttarakhand, Lovely Professional University, Indian Institute of Kanpur, and Indian Institute of Roorkee for the providing CIF facility for the successful completion of this research article.
Disclosure statement
No potential conflict of interest was reported by the author(s).
Authors contributions
Neetu Bora: investigation (lead); methodology (lead), formal analysis (lead), writing original draft (lead), writing-review and editing (lead). Deepika P. Joshi: conceptualization (lead), funding acquisition (lead), methodology (lead), project administration (lead), supervision (lead), validation (lead), writing-original draft (supporting), and writing review and editing (supporting). Mrinal Kanti Adak: formal analysis (lead), writing original draft (supporting), writing-review and editing (lead).
Data availability statement
On reasonable request, the dataset utilized in the current study’s analysis is available.
Ethical approval and consent to participate
The authors declare that they have no known competing financial interests or personal relationships that seem to affect the work reported in this article. We declare that we have no human participants, human data, or human tissues.