Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu

References

• H.J. Li, C. Chen, R.X. Yi, Y.X. Li, and J.L. Wu, Ultrasonic welding of fiber-reinforced thermoplastic composites: A review. Int. J. Adv. Manuf. Technol 120 (2022), pp. 29–57.
   Web of Science ®Google Scholar
• W. Zhang, S.S. Ao, J.P. Oliveira, C.J. Li, Z. Zeng, A.Q. Wang, and Z. Luo, On the metallurgical joining mechanism during ultrasonic spot welding of NiTi using a Cu interlayer. Script. Mater 178 (2020), pp. 414–417.
   Web of Science ®Google Scholar
• W. Zhang, S.S. Ao, J.P. Oliveira, Z. Zeng, Z. Luo, and Z.Z. Hao, Effect of ultrasonic spot welding on the mechanical behaviour of NiTi shape memory alloys. Smart.Mater. Struct 27 (2018), pp. 1–8.
   Web of Science ®Google Scholar
• W. Zhang, S.S. Ao, J.P. Oliveira, Z. Zeng, Y.F. Huang, and Z. Luo, Microstructural characterization and mechanical behavior of NiTi shape memory alloys ultrasonic joints using Cu interlayer. Material 11 (2018), pp. 1–14.
   Google Scholar
• Z.W. Li, X. Zh, L. Ma, S. Wang, X. Liu, and J. Ch, Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics. Ultrason. Sonochem. 49 (2018), pp. 249–259.
   PubMed Web of Science ®Google Scholar
• T. Daeneke, K. Khoshmanesh, N. Mahmood, I.A. de Castro, D. Esrafilzadeh, S.J. Barrow, M.D. Dickeyb, and K. Kalantar-zadeh, Liquid metals: Fundamentals and applications in chemistry. Chem. Soc. Rev. 47 (2018), pp. 4073–4111.
   PubMed Web of Science ®Google Scholar
• M. Rajagopalan, M.A. Bhatia, M.A. Tschopp, D.J. Srolovitz, and K.N. Solanki, Atomic-scale analysis of liquid-gallium embrittlement of aluminum grain boundaries. Acta Mater. 73 (2014), pp. 312–325.
   Web of Science ®Google Scholar
• S.W. Chen, J.M. Lin, T.C. Yang, and Y.H. Du, Interfacial reactions in the Cu/Ga/Co and Cu/Ga/Ni samples. J. Electron. Mater. 48 (2019), pp. 3643–3654.
   Web of Science ®Google Scholar
• M. Ghasemi, B. Sundman, S.G. Fries, and J. Johansson, The thermodynamic assessment of the Au–In–Ga system. J. Alloys Compd. 600 (2014), pp. 178–185.
   Web of Science ®Google Scholar
• W.H. Hui, L. Sun, Y. Zhou, Y.M. Gao, W.Y. Zhai, H. Dong, Y.M. Liu, Q. Gao, and J.H. Peng, Effect of Mg–Ga alloy intermetallic compounds on the properties of soluble aluminum alloy. Intermetallics 144 (2022), pp. 107501.
   Web of Science ®Google Scholar
• B.S. Chen, Y.F. Huang, S.W. Tang, W.S. Liu, and Y.Z. Ma, Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method. J. Mater. Res. Technol. 14(2021), pp. 703–718.
   Google Scholar
• S. Datta, R. Pillai, M.K. Borg, and K. Sefiane, Acoustothermal nucleation of surface nanobubbles. Nano. Lett. 21 (2021), pp. 1267–1273.
   PubMed Web of Science ®Google Scholar
• AUTHORS, Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part II: Cavitation erosion effect. Ultrason. Sonochem. 50 (2019), pp. 278–288.
   PubMed Web of Science ®Google Scholar
• B. Sanga, R. Wattal, and D.S. Nagesh, Weld joint characterization in ultrasonic welding of phosphor bronze sheets. Eng. Sci. Technol. Int. J. 30 (2022), pp. 101040.
   Google Scholar
• J. Liu, B. Cao, and J.W. Yang, Texture and intermetallic compounds of the Cu/Al dissimilar joints by high power ultrasonic welding. J. Manuf. Process. 76 (2022), pp. 34–45.
   Web of Science ®Google Scholar
• Q. Ch, J.Y. Ma, J.L. Zhou, and H.J. Ji, Intrinsic dependence of welding quality and recrystallization on the surface-contacted micro-asperity scale during ultrasonic welding of Cu-Cu joints. J. Mater. Res. Technol. 17 (2022), pp. 353–364.
   Google Scholar
• Y.F. Yan, H.X. Yan, F.X. Chen, K.K. Zhang, and J.H. Zh, Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints, Rare Metal 26 (2007), pp. 51–55.
   Web of Science ®Google Scholar
• S.Q. Liu, S. McDonald, Q.F. Gu, S. Matsumura, D.D. Qu, K. Sweatman, T. Nishimura, and K. Nogita, Properties of CuGa2 formed between liquid Ga and Cu substrates at room temperature. J. Electron. Mater. 49 (2020), pp. 128–139.
   Web of Science ®Google Scholar
• T.F. Grigor'eva, A.I. Ancharov, K.B. Manzyrykchy, K.D. Becker, V. Sepelak, A.P. Barinova, and N.Z. Lyakhov, How the Tin concentration affects the interactions of intermetallic compounds of the Cu–Sn system with liquid gallium and a gallium–Tin eutectic. Russ. J. Inorg. Chem 55(8) (2010), pp. 1275–1278.
   Google Scholar
• РХ ФЕДОРОВП И. АКЧУРИН, Handbook of Indium Chemistry. [M], Peking University Press, Beijing, 2005.
   Google Scholar
• J.L. Xie, Y.H. Chen, L.M. Yin, T.M. Zhang, S.L. Wang, and L.T. Wang, Microstructure and mechanical properties of ultrasonic spot welding TiNi/Ti6Al4V dissimilar materials using pure Al coating. J. Manuf. Process. 64 (2021), pp. 473–480.
   Web of Science ®Google Scholar
• C. Guo, J. Liu, X.H. Li, and S.Q. Yang, Effect of cavitation bubble on the dispersion of magnetorheological polishing fluid under ultrasonic preparation. Ultrason. Sonochem. 79 (2021), pp. 105782.
   PubMed Web of Science ®Google Scholar