About this journal

Smart Science (ISSN 2308-0477) is an international, peer-reviewed journal that publishes significant original scientific researches, and reviews and analyses of current research and science policy. We welcome submissions of high quality papers from all fields of science and from any source. Articles of an interdisciplinary nature are particularly welcomed.

Smart Science aims to be among the top multidisciplinary journals covering a broad spectrum of smart topics in the fields of materials science, chemistry, physics, engineering, medicine, and biology.

Smart Science is currently focusing on the topics of Smart Manufacturing (CPS, IoT and AI) for Industry 4.0, Smart Energy and Smart Chemistry and Materials.

Other specific research areas covered by the journal include, but are not limited to:

1. Smart Science in the Future

2. Smart Manufacturing

• Cyber-Physical System (CPS)
• Internet of Things (IoT) and Internet of Brain (IoB)
• Artificial Intelligence
• Smart Computing
• Smart Design/Machine
• Smart Sensing
• Smart Information and Networks

3. Smart Energy and Thermal/Fluidic Science

4. Smart Chemistry and Materials

Peer review policy
All manuscripts are pre-checked by editors, and if appropriate, sent for single anonymized peer review. Contributions must be original, not previously or simultaneously published elsewhere, also are critically reviewed before they are published. For in-depth review, at least two outside referees are consulted. Reviewers are contacted before being sent a paper and are asked to return comments within 3 weeks for most papers. Reviewers may be selected to evaluate separate components of a manuscript. We greatly appreciate the time spent in preparing a review, and will consult you on a revision of a manuscript only if we believe the paper has been significantly improved but still requires input. The responsibility of final decisions on acceptance or rejection of a submitted manuscript lies with the editors. Editors reserve the right to reject papers without sending them out for review.

Editors-in-Chief:

• Te-Hua Fang, National Kaohsiung University of Applied Sciences, Taiwan, [email protected]
• Cheng-Chi Wang, National Suan Yat-sen University, Taiwan, [email protected]
• Chien-Hung Liu, National Chung Hsing University, Taiwan, [email protected]

Associate Editors-in-Chief

• Tao-Hsing Chen, National Kaohsiung University of Science and Technology, Taiwan, [email protected]
• Hirofumi Hidai, Chiba University, Japan, [email protected]
• Seung Hwan Ko, Seoul National University, Korea, [email protected]
• Chil-Chyuan Kuo, Ming Chi University of Technology, Taiwan, [email protected]
• Ping-Shan Lai, National Chung Hsing University, [email protected]
• Ming-Tsang Lee, National Tsing Hua University, Taiwan, [email protected]

Honorary Editorial Board Members:

• Cha’o-Kuang Chen, National Cheng Kung University, Taiwan, [email protected]
• Ralph Greif, University of California, Berkeley, USA, [email protected]
• Costas P. Grigoropoulos, University of California, Berkeley, USA, [email protected]
• RS Beniwal, CSIR-NISCAIR, India, [email protected]

Section Editorial Board Members:

Section:

Smart Science in the Future

• Khizir Mahmud, University of New South Wales, Australia, [email protected]
• Sara Baber, National University of Sciences and Technology, Pakistan, [email protected]
• Hooman Samani, National Taipei University, Taiwan, [email protected]
• Moon Seung Ki, Nanyang Technological University, Singapore, [email protected]
• Saeed Asadi Bagloee, The University of Melbourne, Australia, [email protected]
• Anis Charrada, University of Carthage, Tunisia, [email protected]
• Carlos Granell Canut, Universitat Jaume I, Spain, [email protected]
• Amjad Mehmood, University of Bahrain, Bahrain, [email protected]
• Claudio Bruzzese, University of Rome Sapienza, Italy, [email protected]
• Ramin Shabanpour, University of Illinois at Chicago, USA, [email protected]

Section:

Smart Manufacturing

• Yun-Hua Li, Beijing University of Aeronautics and Astronautics, [email protected]
• Cheng-Jian Lin, National Chin-Yi University of Technology, Taiwan, [email protected]
• Chih-Jer Lin, National Taipei University of Technology, Taiwan, [email protected]
• Her-Terng Yau, National Chin-Yi university of Technology, Taiwan, [email protected]
• Ching-Hung Lee, National Chung Hsing University, Taiwan, [email protected]
• Chin-Chia Liu, National Changhua University of Education, [email protected]
• Jia-Yang Juang, National Taiwan University, Taiwan, [email protected]
• Dyi-Cheng Chen, National Changhua University of Education, Taiwan, [email protected]
• Chin-Sheng Chen, National Taipei University of Technology, Taiwan, [email protected]
• Hau-Wei Lee, National Chung Hsing University, Taiwan, [email protected]
• Young-Long Chen, National Taichung University of Science and Technology, Taiwan, [email protected]
• Yen-Lin Chen, National Taipei University of Technology, Taiwan, [email protected]
• Hsin-Hui Hu, National Taipei University of Technology, Taiwan, [email protected]
• Sheng-Yuan Yang, LungHwa University of Science and Technology, Taiwan, [email protected]
• Minvydas Ragulskis, Kaunas University of Technology, Lithuania, [email protected]
• Ioakeim Samaras, Intracom S.A. Telecom Solutions, Greece, [email protected]
• Soufiane Faieq, Université Grenoble Alpes, France, [email protected]
• Thomas Braunl, The University of Western Australia, Australia, [email protected]
• Wolfram Schenck, FH Bielefeld University of Applied Sciences, Germany, [email protected]
• Mizanoor Rahman, The Pennsylvania State University, USA, [email protected]
• Bong Jun Choi, Soongsil University, Korea, [email protected]
• Muhammad Usman, Griffith University, Australia, [email protected]
• Rupak Kharel, Manchester Metropolitan University, United Kingdom, [email protected]
• Ali Siadat, Arts et Métiers, France, [email protected]
• Tiziana Segreto, University of Naples Federico II, Italy, [email protected]
• Marco Silvestri, University of Applied Sciences and Arts of Southern Switzerland, Switzerland, [email protected]
• Olga Fink, ZHAW Zurich University of Applied Sciences, Switzerland, [email protected]
• Stanislao Patalano, University of Naples Federico II, Italy, [email protected]
• Kim-Doang Nguyen, South Dakota State University, USA, [email protected]
• José Machado, University of Minho, Portugal, [email protected]
• George Vosniakos, National Technical University of Athens, Greece [email protected]
• Peio Lopez-Iturri, Public University of Navarre, Spain, [email protected]
• Amel Attour, University of Nice Sophia Antipolis, France, [email protected]
• Khalil Drira, LAAS-CNRS, Univ. Toulouse, CNRS, Toulouse, France, [email protected]
• Mariacarla Staffa, Università degli Studi di Napoli Federico II, Italy, [email protected]
• Raul Franco Valverde, Concordia University, Canada, [email protected]
• Bartlomiej Placzek, University of Silesia, Poland, [email protected]
• Guoqing Zhang, University of Windor, Canada, [email protected]
• M.R. Khosravani, Universität Siegen, Germany, [email protected]
• You, Yang, Southern Methodist University, USA, [email protected]
• Chun-Liang Lin, National Chung Hsing University, Taiwan, [email protected]
• Mohamed Arezki Mellal, M’Hamed Bouguerra University of Boumerdés, Algeria, [email protected]
• Farah Bouakrif, University of Jijel, Algeria, [email protected]
• María José Arrojo Baliña, Universidade da Coruña, Spain, [email protected]
• Kouziokas Georgios, University of Thessaly, Greece, [email protected]
• Sergio Fichera, University of Catania, Italy, [email protected]
• Stefano Michieletto, University of Padova, Italy, [email protected]
• Luciano Sánchez, University of Oviedo, Spain, [email protected]
• Debdeep Banerjee, Qualcomm Technologies Inc, USA, [email protected]
• Majed M .Masmali, The University of New South Wales, Australia, [email protected]
• Kidd,Robert M, University of Florida, United States, [email protected]
• Youkyung Won, Kunsan National University, Korea, [email protected]
• Abdelhadi Moufki, Université de Lorraine, [email protected]
• Kalyana Veluvolu, Kyungpook National University, [email protected]
• Jürgen Pilz, Alpen-Adria Universität Klagenfurt, Australia, [email protected]
• Alokesh Pramanik, Curtin University, Australia, [email protected]
• David Valladares Hernando, Universidad Zaragoza, Spain, [email protected]
• Maolin Jin, Korea Institute of Robot and Convergence, Korea, [email protected]
• Chukwuemeka Awah, Michael Okpara University of Agriculture, Nigeria, [email protected]
• Abbas Fotouhi, Cranfield University, United Kingdom, [email protected]
• Lokesh Saharan, University of Texas at Dallas, United States, [email protected]
• Wang Liyu, University of California, Berkeley, United States, [email protected]
• Abdul Mazid, Central Queensland University, Australia, [email protected]
• Yeo Swee Hock, Nanyang Technological University, Singapore, [email protected]
• Rita Pinto, Universidade da Beira Interior, Portugal, [email protected]
• Sobh, Tarek, University of Bridgeport, United States, [email protected]
• Pangun Park, Chungnam National University, Korea, [email protected]
• Togay Ozbakkaloglu, The University of Adelaide, Australia, [email protected]
• Miroslav Langer, Slezská Univerzita, Czech Republic, [email protected]
• George Atsalakis, Technical University of Crete University Campus, Greek, [email protected]
• M. Tanveer, Jawaharlal Nehru University, India, [email protected]
• Lihui Wang, KTH Royal Institute of Technology in Stockholm, Sweden, [email protected]

Section:

Smart Energy and Thermal/Fluidic Science

• Heng Pan, Missouri University of Science and Technology, USA, Nico Hotz, Duke University, USA, [email protected]
• David J. Hwang, Stony Brook University, USA, [email protected]
• Sheng-Chung Tzeng, Chienkuo Technology University, Taiwan, [email protected]
• David T.W. Lin, National University of Tainan, Taiwan, [email protected]
• Yu-Bin Chen, National Tsing Hua University, [email protected]
• Renkun Chen, University of California, USA, [email protected]
• Chuanhua Duan, Bositon University, USA, [email protected]
• Ichiro Ueno, Tokyo University of Science, Japan, [email protected]
• Hironori Nakajima, Kyushu University, Japan, [email protected]
• Robert Wang, Arizona State University, USA, [email protected]
• Bong Jae Lee, Korea Advanced Institute of Science and Technology, Korea, [email protected]
• Daeho Lee, Gachon University, Korea, [email protected]
• Liang Pan, Purdue University, USA, [email protected]
• Coleman Kronawitter, University of California, USA, [email protected]
• Sukjoon Hong, Hanyang University, [email protected]
• Huei-Chu Weng, Chung Yuan Christian University, [email protected]
• Ming-Chang Lu, National Chiao Tung University, Taiwan, [email protected]
• Men-Shen Tsai, National Taipei University of Technology, Taiwan, [email protected]
• Kourosh Kalantar-Zadeh, The University of New South Wales, Australia, [email protected]
• Claude Bayeh, Ecole de Technologie Superieure, Canada, [email protected]
• Carlos Peña, University of Alicante, Spain, [email protected]
• Athanasios Karlis, Democritus University of Thrace, Greece, [email protected]
• Safacas Athanasios, University of Patras, Greece, [email protected]
• Pasquale De Falco, University of Naples Parthenope, Italy, [email protected]
• Alessandro Serpi, Università di Cagliari, Italy, [email protected]
• Sangyoup Lee, University of Science and Technology, Korea, [email protected]
• Davoud Jafari, University of Twente, Netherlands , [email protected]
• Ratan Das, icaPower LLC, India, [email protected]
• Xie, Fei, Oak Ridge National Laboratory, United States, [email protected]
• Mohammad Kimiabeigi, Newcastle University, United Kingdom, [email protected]
• Wencong Su, University of Michigan-Dearborn, United States, [email protected]
• Dinh Hoa Nguyen, Kyushu University, Japan, [email protected]
• Omar Hegazy, Vrije Universiteit Brussel, Belgium, [email protected]
• Naayagi Ramasamy, Newcastle University in Singapore, Singapore, [email protected]
• Elmoselhy, Xiamen University of Technology, China, [email protected]
• Alfonso Capozzoli, Politecnico di Torino, Italy, [email protected]
• Alfredo Gimelli, University of Naples Federico II, Italy, [email protected]
• Kyunghoon Kim, Sungkyunkwan University, Korea, [email protected]
• Lung-Ming Fu, National Cheng Kung University, Taiwan,[email protected]
• Li Xu, National Taiwan University, Taiwan, [email protected]

Section:

Smart Chemistry and Materials

• Jung Bin In, Chung-Ang University, Korea, [email protected]
• Hyung Gyu Park, ETU Zurich, Switzerland, [email protected]
• Yong Shuai, Harbin Institute of Technology, China, [email protected]
• Hojeong Jeon, Korea Institute of Science and Technology, Korea, [email protected]
• Si-Yu Li, National Chung Hsing University, Taiwan, [email protected]
• Hsin-Her Yu, National Formosa University, Taiwan, [email protected]
• Da-Chuan Cheng, China Medical University, Taiwan, [email protected]
• Tao-Hsing Chen , National Kaohsiung University of Applied Sciences, Taiwan, [email protected]
• MJ Jiménez Come, Universidad de Cádiz, Spain, [email protected]
• Bedon Chiara, University of Trieste, Italy, [email protected]
• Luis Vilhena, University of Coimbra, Portugal, [email protected]
• Curtis Larimer, Pacific Northwest National Laboratory, United States, [email protected]
• Soraya Mohamed Mohamed, University of Granada, Spain, [email protected]
• Elmoselhy, Xiamen University of Technology, China, [email protected]
• Uruma Yoshiyuji, Yonago National College of Technology, Japan, [email protected]
• Yu Dong, Curtin University, Australia, [email protected]

News, offers and calls for papers

News and offers

• News: Smart Science has been indexed by Ei Compendex
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Smart Science is now sponsored by Taiwan Society of Intelligent Instrument Inventions and Smart Digital Tech Co., Ltd.