Cyclic deformation behavior of copper single crystals with dispersed SiO₂ particles

H. MiuraDepartment of Mechanical Engineering and Intelligent Systems, The University of Electro-Communications, Chofu, Tokyo, 182-8585, JapanCorrespondence[email protected]

T. SakaiDepartment of Mechanical Engineering and Intelligent Systems, The University of Electro-Communications, Chofu, Tokyo, 182-8585, Japan

H. MizukiriDepartment of Mechanical Engineering and Intelligent Systems, The University of Electro-Communications, Chofu, Tokyo, 182-8585, Japan

M. KatoDepartment of Innovative and Engineered Materials, Tokyo Institute of Technology, 4259 NagatsutaYokohama, 226-8502, Japan

Abstract

Abstract

Cyclic deformation behavior of Cu single crystals with dispersed SiO₂ particles were investigated. Even for a small amount of 0.41 vol.% dispersion of SiO₂ particles, the cyclic deformation behavior was seen to be clearly different from that of pure Cu. There was longer life and slower clack propagation by the dispersion. This would be due to the homogeneous formation of the dislocation substructure in the Cu-SiO₂ sample to prohibit the stress concentration at a point that fastens the clack nucleation. © 2000 Elsevier Science Ltd. All rights reserved.

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Cyclic deformation behavior of copper single crystals with dispersed SiO₂ particles