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SECTION C: DIELECTRIC AND MICROWAVE PROPERTIES

Co-Firing of Low-and High Permittivity Dielectric Tapes for Multifunctional Low-Temperature Co-Fired Ceramics

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Pages 193-202 | Received 26 Jan 2006, Published online: 09 Mar 2011
 

Based on a same glass composition, the compatibilities in cofiring between low-K and high-K hybrid low-temperature co-firing ceramics material systems were studied. By designing a lithium borosilicate glass frit system carefully, we developed an optimum glass frit system for both low-K and high-K dielectric fillers. The effects of glass addition on the densification and electrical properties in low-K and high-K dielectric materials were examined. By adjusting glass compositions and contents, we tried to match low-K and high-K tapes physically and chemically.

Acknowledgment

This research was supported by a grant from the center for Advanced Materials Processing (CAMP) of the 21st Century Frontier R&D Program funded by the Ministry of Commerce Industry and Energy (MOCIE), Republic of Korea.

Paper originally presented at IMF-11, Iguassu Falls, Brazil, September 5–9, 2005.

Notes

1)Commercial powder (MWF-38, Hayashi Chemical Industry, Co. Ltd., Japan).

Dielectric properties were measured using a network analyzer in the frequency range of 9∼16 GHz.

Tan δ [%] were measured using an impedance/gain-phase analyzer (1 MHz).

Dielectric properties were measured using a network analyzer in the frequency range of 12∼ 16 GHz.

Tan δ [%] were measured using an impedance/gain-phase analyzer (1 MHz).

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