Fabrication and characterization of copper containing lead titanam films prepared by sol-gel meihod

Abstract

Sol-gel method has been adopted to make copper-doped lead titanate (PT) films with perovskite structure by reacting liquid precursors to form sol. The films were deposited on stainless steel substrate by using multilayer spin coating operation. The films were then annealed at temperatures close to 600°C. The films thus obtained were crack free and the ferroelectric behaviour was confirmed by studying hysteresis loop measurements. Dielectric constant was around 230 and coercive field was greater than 80 W/cm for the films with finer grain sizes. The films exhibited remanent polarization 2 values close to 30 micro-coulanbs/cm.