Packaging Techniques for Electronic Systems

Summary

This paper summarizes the current position in respect of packaging and interconnections for electronic systems. The word ‘packaging’ is used in the true sense of the term and embraces any method of assembling sub-systems and other parts which together form a computer, radar system or other electronic equipment. Techniques covering welded modules, printed wiring—including multilayer boards—lightweight foam encapsulating and large-scale monolithic integrated circuits are discussed, together with every aspect of micro-electronics influence on packaging.