The throwing power of acid copper plating processes for printed circuit boards

Summary

The literature on the use of the acid copper sulphate process for copper plating printed circuit boards is reviewed, and the specific requirements of the circuit industry described. The results of Hull cell, Haring cell and pilot plant studies on the throwing power of different processes and additives are reported and discussed. The results show the effect of different additives and solution compositions on both “hole throwing power” and macro throwing power, and show that the Haring cell is the preferred means of measuring throwing power for this electrolyte.