New development in high speed copper plating for printed wiring board applications

Summary

The driving force for high speed acid copper systems is improved productivity. Using electrochemical engineering principles, processes have been developed which address this need. Model cost analysis demonstrates a 40 per cent savings from these systems. Production data has confirmed both the technical and economic benefits. This paper summarises the development of high speed acid copper processes with emphasis on process chemistry, theoretical electrochemical engineering, system development and field data.