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SUMMARY
A new super high speed electroless nickel plating process with a deposition rate of 25 to 28 μm/h has been developed. The influences of the concentrations of nickel salt, reducing agent, organic additives such as buffer, complexing agent and accelerator, the pH value, and solution temperature on the deposition rate were studied gravimetrically. The crystal structure and composition of the deposit were also determined by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS).
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Notes on contributors
Han Keping
Mr Han Keping is a graduate in the Institute of Chemistry and Chemical Technology, Nanjing University. He holds a BS in the Department of Chemistry from Xinyang Normal College. His research includes chemical polishing, electroless nickel, tin-lead, and gold plating, direct metallisation of printed circuit boards, anticorrosive conversion coatings etc. He has published about 40 scientific and technical papers in the field of metal finishing and corrosion.