![Sample our Engineering & Technology journals, sign in here to start your access, latest two full volumes FREE to you for 14 days]({"type":"image" , "src" : "/sda/5933/TOC-Subject-Sample-2021-Engineering-Tech.jpg"})
SUMMARY
A uniform, bright, high purity gold deposit can be obtained by using a dip gold plating process, characterized by high bath stability. The properties of the deposit have been examined by SEM, SRD and XPS.
Keywords:
Additional information
Notes on contributors
Han Keping
Mr Han Keping is a graduate in the Institute of Chemistry and Chemical Technology, Nanjing University. He holds a BS in the Department of Chemistry from Xinyang Normal College. His research includes chemical polishing, electroless nickel, tin-lead, and gold plating, direct metallisation of printed circuit boards, anticorrosive conversion coatings etc. He has published about 40 scientific and technical papers in the field of metal finishing and corrosion.