Summary
This study examines the activation step, prior to electroless plating, of two of the most used particles in the field of electrochemical composite coating: PTFE and graphite. It has been identified that PTFE particles show an unusual behaviour according to the diameter size of the mixed Pd/Sn colloidal catalyst. It appears that the geometry of these micronic particles strongly affects the activation step. Only small colloidal catalysts with a 3 nm diameter can activate the surface efficiently without any surface pre-treatment. A detailed description and an explanation of this phenomenon are given.
Additional information
Notes on contributors
A. Fares Karam
Mr. Antoine Fares Karam is a Ph.D. student in material engineering at the “Ecole centrale de Lyon” in France. He holds a DEA (Diplômes d'études Approfondies) in Anaytical Chemistry from the University of “Lyon I”. His fields of research are electroless plating and the electrochemical characterization of thin metallic films.
J. M. Krafft
Jean Marc KRAFFT is a research engineer at the ‘Ingenierie et Fonctionnalisation des Surfaces’ Laboratory in the Ecole Centrale de Lyon, Ecully, France. His main activities concern Scanning Electron Microscopy and Raman Spectroscopy and his field of research is electroless plating and its application in Scattered Enhanced Raman Spectroscopy. He is an active member and the ex-president of Philips Scanning Electron Microscopy Association.
G. Stremsdoerfer
Dr. Guy Stremsdoerfer is a professor and researcher at the “Ecole centrale de Lyon”, 36 Av Guy de Collongue, 69131 Ecully Cedex, France. He is the head of the team working in the field of “Elaboration of multifunctional and superficial structures” at the “Ingenierie et Fonctionnalisation des Surfaces” laboratory. He holds a Ph.D. degree from the University of “Lyon I” and an engineering degree from “Institut de Chimie et Physique Industriel de Lyon”. He has more than 10 years experience in electroless plating on semi-conductors and non conductors. His research field includes realization of ohmic contacts, plating of electronic circuits and nanotechnology tools.