Investigation of the Interaction Between Cu_2-x S +S^o Coatings and Pd(II) Ions by Cyclic Voltammetry and X-ray Photoelectron Spectroscopy

SUMMARY

The interaction between Pd²⁺ ions and Cu_2-xS coating formed by three cycles and containing ~30 at.% of elementary S has been investigated by the methods of cyclic voltammetry and photoelectron spectroscopy (one cycle of coating formation includes treatment of the surface with Cu(I)+Cu(II) ammoniate solution, hydrolysis of the adsorbed copper compounds and sulphidation of copper oxygen compounds in Na₂S_n solution). After exposure of such a coating to Pd²⁺ ions (1.7 mM PdCl_2’ pH-2), an exchange as well as a redox interaction between the coating components and Pd²⁺ ions has been shown to occur. Due to this the amount of copper in the coating decreases from 2 to 4 times and that of sulphur from 1.5 to 5 times. The coating modified in such a way has been found to contain up to 75 at.% of palladium, ~90% of it being in a metallic state.

It has been determined that at the beginning S^o is bound into a soluble compound:

2Pd²⁺ + S^o + 3H₂O → 2Pd^o + H₂SO₃ + 4H⁺.

The Cu₂S present in the coating is considered to interact with Pd²⁺, with the formation of Pd⁰ and CuPdS_2’, while CuS reacts most likely according to the reaction:

CuS + 3Pd²⁺ + 3H₂O → 3Pd^o; + H₂SO₃ + Cu²⁺ + 4H⁺.

The Cu_2-xS +S^o coating formed on a dielectric and modified with Pd²⁺, contrary to the initial Cu_2-xS +S^o coating, can be plated with copper from any electrolyte for copper deposition.

Keywords:

• non-stoichiometric copper sulphide
• sulphur
• cyclic voltammetry
• XPS investigation