Direct Patterning of Silver Circuit Using Surface- modification and UV Irradiation on Polyimide Resin

Hidemi NawafuneDepartment of Functional Molecules Chemistry, Faculty of Science & Engineering, Konan University, 8-9-1 Okamoto, Higashinada-Ku. Kobe658-0072, Japan

Taro NishiokaDepartment of Functional Molecules Chemistry, Faculty of Science & Engineering, Konan University, 8-9-1 Okamoto, Higashinada-Ku. Kobe658-0072, Japan

Shozo MizumotoDepartment of Functional Molecules Chemistry, Faculty of Science & Engineering, Konan University, 8-9-1 Okamoto, Higashinada-Ku. Kobe658-0072, Japan

Masaru SeitaLeaRonal Japan Incorporated, Yoshino-cho 2-Chome, Saitama-city, Saitama330-0031, Japan

Masaaki ImanariLeaRonal Japan Incorporated, Yoshino-cho 2-Chome, Saitama-city, Saitama330-0031, Japan

Toshinobu KanaiVictor Company of Japan, Limited, 12, 3-Chome, Moriya-cho, Kanagawa-ku, Yokohama, Kanagawa221-8528, Japan

SUMMARY

A simplified method is proposed for the formation of a silver circuit pattern on a polyimide resin substrate through modification of the resin surface followed by adsorption of silver(l) ion and UV photoreduction to form patterns. The amide bond and carboxyl group, as a cation exchange group, were formed on the polyimide resin surface by a potassium hydroxide treatment. UV irradiation of the adsorbed silver(I) ion results in the formation of a silver thin film. Silver circuit patterns are easily formed on the modified polyimide resin substrates without using a plating resist by use of a metal-on-quart: mask

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Direct Patterning of Silver Circuit Using Surface- modification and UV Irradiation on Polyimide Resin

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