Internal Stress in Electrodeposited Nanocrystalline Ni-Cu Alloys

SUMMARY

Brenner and Senderoff's spiral contractometer has been used to measure the residual stress (macrostress) in the electrodeposited nanocrystalline Ni-Cu alloys plated by pulse electrolysis. The stress in the deposit was observed as tensile in nature. The effects of the various pulse parameters, pulse frequency (f), average current density (J_a), pulse on-time (T_on), pulse off-time (T_off), temperature and pH on the stress of the deposit were studied and compared to those obtained under direct current deposition. Bath temperature and pH effects on the variation of tensile stress (σ) with thickness have also been studied. Microstress in the nanocrystalline deposit has been studied from the peak broadening of the X-ray diffraction peaks.

Keywords:

• Internal stress
• nanocrystalline
• electrodeposition
• alloy
• Ni-Cu