Effects of 3-Thiothiol-1-propane-sulphonic acid sodium salt and Sulphuric Acid on the Initial Stages of Copper Electrodeposition

L. Huang (Department of Chemistry, Xiamen University, State Key Laboratory for Physical Chemistry on the Solid Surface, Institute of Physical Chemistry, Xiamen361005, P.R.China)

F.Z. Yang (Department of Chemistry, Xiamen University, State Key Laboratory for Physical Chemistry on the Solid Surface, Institute of Physical Chemistry, Xiamen361005, P.R.China)

S.K. Xu (Department of Chemistry, Xiamen University, State Key Laboratory for Physical Chemistry on the Solid Surface, Institute of Physical Chemistry, Xiamen361005, P.R.China)

S.M. Zhou (Department of Chemistry, Xiamen University, State Key Laboratory for Physical Chemistry on the Solid Surface, Institute of Physical Chemistry, Xiamen361005, P.R.China)

SUMMARY

Initial stages of copper electrodeposition on a glassy carbon electrode from acid sulphate solutions are studied using cyclic voltammetry and chronoamperometry. The electrolyte consisted of 0.05 mol dm³ copper sulphate and 1.4 ∼ 1.8 mol dm ³ sulphuric acid containing 2 × 10² g dm ³ 3-thiothiol-l-propane-sulphonic acid sodium salt (NaO₃S (CH₂)₃ SSH). The results show that the additive produces an initial inhibition of copper deposition, probably related to the adsorption whereas sulphuric acid promotes copper electrodeposition. The initial deposition kinetics corresponds to a model including instantaneous nucleation and diffusion controlled growth. Addition of 3-thiothiol-l-propane-sulphonic acid sodium salt and sulphuric acid does not change the initial nucleation of copper electrocrystallisation but it increases the nucleation rate and the number density of nuclei at the surface.

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Effects of 3-Thiothiol-1-propane-sulphonic acid sodium salt and Sulphuric Acid on the Initial Stages of Copper Electrodeposition

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Effects of 3-Thiothiol-1-propane-sulphonic acid sodium salt and Sulphuric Acid on the Initial Stages of Copper Electrodeposition

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