Intelligent process design system for the transfer moulding of electronic packages

Abstract

Currently, mould design and the setting of the process parameters of transfer moulding for electronic packages are done manually in a trial-and-error manner. The effectiveness of the setting of parameters is largely dependent on the experience of engineers. The paper describes an intelligent process design system for transfer moulding of electronic packages that is used to determine optimal mould design parameters and the setting of the process parameters mainly based on case-based reasoning, artificial neural networks and a multiobjective optimization scheme. The system consists of two modules: a case-based reasoning module and a process optimization module. The former module is used to determine initial mould design parameters and the setting of the process parameters while the latter module is used to determine optimal mould design parameters and the setting of the process parameters. Implementation of the intelligent system has demonstrated that the time for the determination of optimal mould design parameters and the setting of the process parameters can be greatly reduced, and the setting of parameters recommended by the system can contribute to the good quality of moulded packages.

Acknowledgements

Research was supported by grants from the Research Grants Council of Hong Kong, China (Project No. PolyU5165/99E) and The Hong Kong Polytechnic University, Hong Kong, China (Project No. B-Q341).