Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Abstract

This study investigated the feasibility of ultrasonic bonding of a rigid printed circuit board (RPCB) to a flexible printed circuit board (FPCB) with a non-conductive film (NCF) for improving the long-term reliability and lowering the manufacturing cost. Peel tests of the joints were carried out with increasing bonding time to optimize the bonding condition. High-temperature storage and thermal cycling tests were carried out to evaluate the reliability. The RPCB was successfully bonded to the FPCB with NCF using a transverse ultrasonic bonding. The optimum time taken for bonding was 3 sec. The joints with NCF showed a good reliability after the high-temperature storage test at 125°C for 1,000 h and the thermal cycling test for 1,000 cycles.

Keywords:

• Flexible printed circuit board (FPCB)
• Non-conductive film
• Peel test
• Reliability test
• Rigid printed circuit board (RPCB)
• Ultrasonic bonding

ACKNOWLEDGMENT

The present work was carried out with the support of a Next Generation New Technology Development Program (Project No. 10030049) of the Korea Ministry of Commerce, Industry, and Energy (MOCIE).

Notes

Presented in part at the 2nd International Conference on Advance Computational Enginnering and Experimenting (ACE-X 2008), Barcelona, Spain, 14–15 July, 2008.