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Abstract
In this study, novel fast-curing electrically conductive adhesives were prepared from a functional epoxy, a reactive diluent, a silane coupling agent, a curing agent, and micro silver flakes. Differential scanning calorimetry, Fourier transform infrared spectroscopy, four-probe method, shear test, impact test, scanning electron microscopy, and energy dispersive spectroscopy revealed the physical, electrical, mechanical, and thermal properties of these electrically conductive adhesives. They were cured at 120°C and 150°C for 15 min, and had low bulk resistivity, high shear strength, and low water absorption. They can be used in the electronic packaging and improve the related production efficiency greatly.