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Abstract
The changes in the dielectric properties of a curing thermoset adhesive can be correlated with the chemical and rheological changes that occur during the cure. The progress towards the use of these real time events to control the bonding process is discussed. The primary mathematical relationships are described, the influence of chemical structure is discussed, monitoring under shop conditions is demonstrated and a correlation between the dielectric signal, heat of reaction and wetting angle is developed for a specific adhesive.