Performance of SiO₂ Filled Functional Polypropylene Substrates for 5th Generation Communication

Abstract

Three grades of functional polypropylene (FPP)/silica (SiO₂) (FPP_ASP16^xSiO₂^y, FPP_ASP17^xSiO₂^y and FPP_ASP18^xSiO₂^y) and their crosslinked FPP/SiO₂ (CLFPP_ASP16^xSiO₂^y, CLFPP_ASP17^xSiO₂^y and CLFPP_ASP18^xSiO₂^y) nanocomposites were satisfactorily made for applying as fifth generation (5 G) mobile communication substrates. Significantly smaller linear thermal expansion coefficient (LCTE) but larger dielectric constant (ε_r), dielectric loss (tan δ) and onset degradation temperature (DT_onset) were acquired for CLFPP_a^xSiO₂^y than those of the corresponding FPP_a^xSiO₂^y sequence having identical SiO₂ loadings. It is worth emphasizing that substantially smaller ε_r, tan δ and LCTE values were acquired for every FPP_a^xSiO₂^y and CLFPP_a^xSiO₂^y sequence filled with appropriate SiO₂ loadings. Quite small ε_r/tan δ ( 2.41/0.00539, 2.36/0.00361, 2.53/0.00653, 2.52/0.00671, 2.46/0.00461 and 2.62/0.00821, all measured at 1 MHz) and LCTE (∼140 ppm/°C, 152 ppm/°C, 75 ppm/°C, 127 ppm/°C, 142 ppm/°C and 56 ppm/°C) values suitable for 5 G communication were acquired for FPP_ASP16⁹⁵SiO₂⁵, FPP_ASP17⁹⁴SiO₂⁶, FPP_ASP18⁹⁵SiO₂⁵, CLFPP_ASP16⁹⁵SiO₂⁵, CLFPP_ASP17⁹⁴SiO₂⁶ and CLFPP_ASP18⁹⁵SiO₂⁵ filled with optimum loadings of SiO₂ nanoparticles, respectively. All free volume properties estimated for every FPP_a^xSiO₂^y and CLFPP_a^xSiO₂^y sequence enlarged to a largest value as the SiO₂ loadings approached the corresponding optimum value. Possible reasons accounting for these substantially diminished dielectric and LCTE and improved thermal degradation properties of the FPP_a^xSiO₂^y and CLFPP_a^xSiO₂^y films are proposed.

Keywords:

• 5G communication
• dielectric properties
• free volume property
• functional polypropylene
• linear coefficient of thermal expansion
• SiO₂ nanoparticles
• Thermal stability

Disclosure statement

No potential conflict of interest was reported by the authors.