Abstract
Only a minority of the public familiar with the silicon chip appreciate how deeply photographic processes are involved in ihe fabrication of these extraordinary devices. In fact two photographic materials were involved. Firstly, “grainless” emulsions were used to produce the hyper-line patterns 01 masks used lor each production stage. Secondly, photoresists received the imprint of these masks ami produced ihe stencils required for the photomechanical operations. Both materials were ready and wailing to provide for the needs of the electronics industry.