Abstract
The silicon amorphization process during heavy ion implantation is considered. Expressions are derived for the critical doses, ϕ0 and ϕcr for silicon amorphization at low and room implantation temperatures. respectively. Silicon amorphization doses are calculated for Kr+, Xe+, Nd+, Yb+, and Hg+ ions. ϕ0 is shown to decrease by a factor of 1.5 to 2 in the energy range 10 to 100 keV, and with further increase in energy ϕ0 is shown to remain constant. At low energiesE ≲ 40 keV critical doses for silicon amorphization depend weakly on ion mass and implantation temperature (in the range 100 to 300 K). The value of ϕcr/ϕ0 increases with energy and decreases with increasing implanted ion mass. The results of calculations agree well with experimental data.