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Correspondence

Low-temperature recovery creep of a Cu-SiO2 alloy

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Pages 615-618 | Received 22 Aug 1979, Accepted 21 Dec 1979, Published online: 27 Sep 2006
 

Abstract

Recovery creep, brought about by the accumulation of Orowan loops due to plastic deformation and their annihilation, has been studied in a Cu-SiO2 alloy. A fourth-power dependence of the stationary creep rate on the particle size, and a linear dependence on the applied stress, has been confirmed, in agreement with an analysis in which the annihilation of Orowan loops is considered to be due to their climb caused by dislocation pipe diffusion.

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