Abstract
The dislocation structures in silicon single crystals deformed up to the lower yield point at moderate temperatures (823 K ≲ T ≲ 1073 K) and low shear strain rates (γ<2×10−4s−1) were estimated by transmission electron microscopy. Both the total dislocation density ρt and the mobile-dislocation density ρm could be measured rather accurately, at least when the dislocations lie preferentially along ⟨110⟩ orientations. Local shear stresses were estimated from the radius of curvature at dislocation bends. With the distribution of local stresses and the known dislocation velocities, an average velocity v and the corresponding effective stress τeff could be derived. The internal consistency of the measured ρm and τeff was checked using Orowan's relation
where b is the Burgers vector, and was found to be good at sufficiently high stresses (τ1y ≳ 10 MPa), giving support to the view that, in those conditions, τeff is probably much closer to τly than predicted by current models.