Temperature dependence of the diffusion coefficient of vacancies in Cu₃Au

Abstract

Temperature dependence of the diffusion coefficient of vacancies in Cu₃Au has been studied from the annealing kinetics of voids. The measurement is carried out in a temperature range between 473 and 673 K. The activation energy at temperatures between 473 and 573 K is estimated to be 2·02 ±0·04 eV, while the peculiarity of the diffusion coefficients is seen in a temperature range from 573 to 673 K. The reason is discussed briefly in terms of the order-disorder transition of Cu₃Au.