Jet Impingement Boiling on Monocrystalline Silicon Surfaces with Open Microchannels

Abstract

Thermal management of electronic devices with great critical heat flux (CHF) and lower wall temperature is critical issues. To address it, the cooling method based on jet impingement boiling is experimentally explored. The effects of heat surface modification, vertical expansion angle of flow microchannels, and negative back pressure are emphasized. The vertical expansion angle, flow rate and average pressure are 0°–30°, 10–30 L/h, and 0.04–0.1 MPa, respectively. It is found that the CHF changes non-monotonically with the increase of the vertical expansion angle of the open flow microchannel since both flow resistance and bubble detachment performance. A maximum CHF reaches at 381 W/cm² for the jet impingement boiling on a modified monocrystalline silicon surface with microcolumns under the condition of open microchannels with the vertical expansion angle of 20° and the pressure of 0.1 MPa. Moreover, compared with 0.04 MPa, a greater pressure of 0.1 MPa increases the boiling temperature, thus inhibiting explosive boiling and enhancing the CHF.

Acknowledgments

The authors gratefully acknowledge the financial support from Shaanxi Science and Technology Department (2021KWZ-15), the Ministry of Science and Technology of the People’s Republic of China (2017YFE0100600).

Additional information

Notes on contributors

Wenxiu Zheng

Wenxiu Zheng received her Ph.D in Xi’an Jiaotong University, China. Her main research fields are multiphase interface characteristics, regulation and applications, multiphase heat transfer, and the optimization of the thermal energy systems.

Tiefeng Chen

Tiefeng Chen has worked with Fotile Company since 2020 as a R&D Engineer. He received his master’s degree in Xi’an Jiaotong University in China. He is devoted to the investigation of multiphase heat transfer and heat dissipation of electronic devices.

Palash Sen

Palash Sen is a Ph.D. candidate in the school of Energy and Power Engineering at Xi’an Jiaotong University, China. His research interests include thin-film evaporation, boiling test and development of novel cooling systems for high power LEDs for enhanced reliability and lifetime.

Bofeng Bai

Bofeng Bai is a distinguished professor in Xi’an Jiaotong University, China. He obtained his Ph.D. in Power Engineering & Engineering Thermophysics at the State Key Laboratory of Multiphase Flow at Xi’an Jiaotong University, China in 1999. He has won prestigious awards and honors including China National Funds for Distinguished Young Scientists in 2014 and Leading Talent in Science and Technology Innovation in 2017. His research interests are fundamentals of multiphase flow and heat transfer, and applications in power and propulsion, petroleum engineering, and thermal engineering. He is AE of Measurement, Journal of Mechanical Engineering Science (Proc. IMechE Part C), and Measurement: Sensors.