A clamped punch-loaded blister test for adhesion: a lumped parameter model and the bending-to-stretching behavior

Abstract

This paper presents a clamped punch-loaded blister test and the corresponding lumped parameter model for the adhesion between thin film and rigid substrate. In the test, circular thin film is adhered to rigid substrate and an external load is applied with a clamped punch to cause the deflection of thin film. The relations among load, deflection, residual stress and strain energy release rate are thoroughly investigated. Analytical solutions in linear and nonlinear behaviors are obtained and the bending and stretching effects are associated through a lumped parameter model. The result of lumped-parameter model shows that the blister deflection is directly proportional to the applied load in the linear bending dominant region and the blister deflection is in direct proportion to the cubic root of the applied load in the nonlinear stretching dominant region. This has been proved by the result of nonlinear finite element analysis and the experimental result as well.

Keywords:

• thin film
• blister test
• adhesion
• lumped parameter model

Disclosure statement

No potential conflict of interest was reported by the authors.

Additional information

Funding

This work was supported by National Program on the Development of Scientific Instrument and Equipment [2011YQ160002]; Fundamental Research Fund for Central Universities [HUST2010MS090].