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Abstract
Introduction: The aim of this study was to evaluate the residual monomer release from orthodontic adhesives cured with light-emitting diode (LED) and halogen light sources.
Methods: Seven hundred and twenty stainless steel brackets were divided into 3 groups according to the adhesive system used (Transbond XT light-cure adhesive [TXT], Transbond LR capsule [LR], and Light Bond light-cure adhesive paste [LB]), and each group was divided into 2 subgroups according to light-curing procedure (LED or halogen). Brackets were bonded with adhesives onto tooth buccal surfaces and polymerized. Each specimen contained 24 brackets that simulated the oral environment (n = 5). The specimens were immersed in a 75% ethanol/water solution at 37 °C for 10 min, 1 h, 1 d, 7 d, 14 d, and 30 d, respectively. Eluted monomers (Bis-GMA, UDMA, and TEGDMA) were detected using HPLC.
Results: There was residual monomer release at all time periods, and the highest amount of release was observed cumulatively on the 30th day. The cumulative Bis-GMA released from adhesives was not different (p > 0.05). The cumulative TEGDMA released from adhesives was statistically different (p < 0.05). There was no statistical difference between QTH and LED light-curing units for each adhesive (p > 0.05).
Conclusions: The release of residual monomers stays at a high level for a long time after polymerization. The total leaching of residual monomers from the Light Bond light-cure sealant resin plus Light Bond light-cure adhesive paste was higher than that of other materials for both curing units. Different curing units (LED or QTH) did not affect the monomer release from the orthodontic adhesives.