Abstract
Thermoelectric (TE) materials can provide solid state heating, cooling, and power generation—with the potential to reduce greenhouse gases and to provide cleaner energy. Practical accomplishment of these objectives require stability of TE materials at high operating temperatures and in reactive environments. We propose to provide that stability by encapsulation of TE materials and devices in high temperature polymers (HTPs). Elimination of air pockets inside TE devices require strong wetting of TE materials by HTPs. We report wetting angles of three HTPs on four TE materials.
Acknowledgments
The starting point for this work was a recommendation from Dr. Carl Johnson, II-VI Foundation, Bridgeville, Pennsylvania. Prof. Richard F. Reidy III at the University of North Texas has kindly allowed us to use—and even modify for our purpose—equipment in his laboratory. We also appreciate helpful comments of a reviewer and detailed guidance from the Editor.