Electroplating of Copper in the Presence of 5,6-Dihydropyrimidine-2-(1H)-thione, 2-Methylthiopyrimidine-4-(1H)-one, 2-Thiopyrimidine-4-(1H)-ones, and 2,4-Pyrimidine(1H,3H)-dione Derivatives as Organic Additives

Abstract

The electrode processes on copper in acidified CuSO₄ has been foundto depend on the organic additives as well as their concentrations. They also depend on the type of the anode and temperature. The activation energy proves that the reaction is diffusion controlled. The percentage of acceleration for all solutions ranged from 15% to 65% and depended on the type of the cathode and the concentration of the additive. The order of inhibition efficiency of copper cathode is: compound 6 > compound 1 > compound 3 > compound 5 > compound 4 > compound 2. The overall mass transfer correlation proves that the electroplating reaction is natural convection, which is in accordance with our previous studies.

Keywords:

• Corrosion inhibition
• electrodeposition
• limiting current
• mass transfer
• thiopyrimidines