Abstract
This study focuses upon building an automated inspection system for the in-line measurement of bond-line thickness (BLT) and die tilt in die attachments in the semiconductor packaging process. A prototype of a visual system utilizing the line scan stereo vision technique via two linear CCD cameras has been developed for the die bonding quality inspection. A novel algorithm is proposed for the determination of the 3D coordinates of certain points on an object. The BLT and die tilt of a die attached chip of substrate height 800 μm and cross section 15 × 15 mm2 were measured to be approximately 76.8 μm and 0.00094, respectively. The measurement can be completed within one second. Thus the in-line inspection of die bonding quality can be conducted efficiently using the proposed technique.
Funding
The authors gratefully acknowledge the support of the Ministry of Science and Technology of Taiwan under project number NSC 102-2218-E-033-002-MY2.