Properties of TiC_p/Cu composites fabricated by powder metallurgy and electrodeless copper plating

Abstract

In situ spherical TiC_p-reinforced copper matrix composites were prepared via hot-pressing sintering assisted with copper plating. Brinell hardness and electrical conductivity of composites with various contents were investigated, room temperature compression properties and fractography of optimal TiC_p/Cu composites and sintered pure copper were analysed. It was found that with the increase of TiC_p content, Brinell hardness of composites was increased, while electrical conductivity decreased. When TiC_p content was 1.0 wt-%, the Brinell hardness increased significantly and the conductivity was maintained at a high level. Compared with sintered pure copper, the yield strength and ultimate compressive strength of the composites were improved, while the fracture strain was reduced.

KEYWORDS:

• Copper plating TiC_p
• copper matrix composites
• properties
• fractography
• conductivity

Acknowledgements

We would like to acknowledge Jilin University and Northeast Electric Power University.

Disclosure statement

No potential conflict of interest was reported by the author(s).