Adsorption of Cu(II) on Surface Ion-Imprinted Poly(Allylamine)-Silica Material from Aqueous Solution

Abstract

The aim of present study was to investigate the adsorption properties of Cu(II) ion-imprinted poly(allylamine)-silica (IIP-PAA/SiO₂) in aqueous solutions by static and dynamic methods. The results showed that copper adsorption capacity of IIP-PAA/SiO₂ reduced with increasing the temperature, and ΔH ⁰ was negative value and elevating temperature was not helpful to adsorption. Adsorption kinetics data could be described by pseudo–second-order kinetics equation, and fitting adsorption rate constant and balanced adsorption capacity were related to initial solution concentration. Besides, IIP-PAA/SiO₂ had excellent column adsorption property and reusability. Neither copper adsorption capacity nor breakthrough time decreased obviously after six dynamic adsorption–desorption cycles.

Keywords:

• Cu(II)
• Poly(allylamine)
• Silica
• Surface imprinting

ACKNOWLEDGMENT

The authors acknowledge the financial support provided by the Key Science and Technology Project of Henan Province (No. 112102210237).

Notes

*Represents the kinetic adsorption parameters of PAA/SiO₂.

*IIP-PAA/SiO₂: m = 0.15 g; V = 25 mL; C_cu = 5.1 mmol · L⁻¹; Temperature: 298 K; Time: 24 h.