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Abstract
Flip chip bonding is one of the new bonding techniques introduced in the past few years to overcome the problems of high labour cost and limited reliability associated with conventional (chip & wire) bonding. The major part of flip chip bonding is the formation of ‘Bumps’ on the conventionally produced silicon monolithic chip. The techniques for fabrication of ‘Aluminium Bumps’ and ‘Solder Bumps’ have been tried at Solidstate Physics Laboratory and are described.