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Abstract
Wave soldering is better than drag or dip soldering for printed circuit boards. The thickness of solder deposited on the copper clading of P. C. board is a function of conveyor speed and bath temperature in case of wave soldering. With increase in bath temperature, fluidity of the molten solder increases and therefore coating thickness is decreased. While speed of the conveyor which passes over the preheater for activation of flux affects the flux, therefore lower thickness of coating is obtained at lower speeds.