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IETE Journal of Research Volume 22, 1976 - Issue 2
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Original Articles

Environmental Protection by Potting and Embedding

B. S. RaoISRO, Hqrs. Banglore-560 009.
&
G. N. SharmaElectronics Systems Division, Space Application Centre, Ahmedabad380 015.
Pages 87-90 | Received 05 Jun 1973, Published online: 11 Jul 2015
 
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Abstract

Potting and embedding are the main techniques which are used to protect electronic modules against moisture, shock, excessive heat, high altitude effect and cracking of soldered points in arid zones. Various methods and materials used in potting and embedding have been discussed in this paper.

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