Recent Trends in Thick-Film Hybrid Circuits

Abstract

Thick-film hybrid technology provides a high degree of flexibility in the design and fabrication of electronic circuits. This has resulted in wider applications of this technology. Present research is directed towards search for new substrate materials, new thick-film paste compositions with a view to reduce the cost of the thick-film hybrid circuits and to increase their applicability.

This paper reviews the recent trends in this area outlining the commonly used and newly developed materials and components. Some information is also given on the technology aspects of hybrid circuits. The possible applications of hybrid circuits have been listed. Some data on cost analysis, as applicable abroad, has been provided. Smaller initial investment, smaller prototype development time and economy even at smaller production levels are some of the distinct advantages of hybrid circuits when compared with monolithic integrated circuits.

Indexing Terms:

• Thick-Film Technology
• Hybrid Circuits