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Abstract
A field analysis has been developed to derive an expression for an important design parameter, viz., the dielectric loading factor of a dielectric wedge-supported helix, enclosed in a glass envelope which is very commonly used in medium-power, broad-band TWT's. The result is compared with a corresponding metal envelope situation.
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Notes on contributors
A.K. Sinha
Sinha, (A K): (b. 1954 July 23, Bhabua, Bihar); Obtained BSc (Hons) and MSc both in Physics from Ranchi University, in 1973 and 1975, respectively. At present, working towards PhD degree.
His current areas of interest are electron beam devices, MIC's and optical wave-guides