Decapsulation Of Silicone Potted Electronic Assemblies

Abstract

The decapsulation of silicone potted electronic assemblies is useful for failure analysis of the modular system and sub-systems This is suitably done by ultrasonic stirring of the electronic assembly in a mixture of trichloro-ethylene, carbon tetrachloride and ethylene di-chloride. This also does not affect most of the other polymers like polyethylene phenolics, epoxies, PVC and also metals which are used in assemblies of various circuits. Conformal coatings are removed faster than volumetric encapsulation. This is also useful for recovery and repair of modular systems, analysis of potted circuits, quality control and salvage of precious metals or components out of damaged assemblies.

Indexing Terms:

• Decapsulation
• Electronic Assemblies
• Failure Analysis