Considerations in the Choice of Mask Pattern Generation Technique

Abstract

Pattern generation to generate masks after designing of a circuit is an important step in the manufacturing of integrated circuits. The input to pattern generator is a magnetic tape called PG tape and output is a reticle or full field IX mask.

Pattern generation involves several issues such as economic viability of pattern generation systems as capital costs involved are very high, throughput considerations, the type of product or product mix to be manufactured eg, IX, 5X or 10X reticle, IX full field mask etc, complexity of device patterns, minimum feature size on masks, capability of pattern generation system to meet critical dimension, registration/overlay, permissible defect density- specification and process related issues. In this paper, an analysis of various pattern generation techniques has been done with respect to these issues.

Criticality of the various issues with respect to a particular application has been studied. The study would help users of pattern generators to identify a pattern generation technique most appropriate to their requirements.

Indexing terms:

• Mask pattern generation technique
• Integrated circuits