An Overview of Metallization Technologies for High Voltage and Smart-Power Applications

Abstract

Recent advances in high-voltage device technologies have resulted in stringent metallization requirements because of reduced feature size, and improved high-frequency switching and power-handling requirements. The emergence of smart-power applications demonstrate a critical need for processing compatibility of signal and power devices. This paper reviews the current status and future trends in metallization of silicon device technologies for high-voltage and smart-power applications.

Indexing terms:

• Metallization technologies
• Contact and gate metallization