Thermal Modeling of Integrated Circuits

Abstract

This paper discusses the problem of heat generation, heat conduction and the effects of these on the performance of integrated circuits. The result obtained is in the form of two dimensional isothermal contours on the chip. Using these contours, the location of the various functional blocks and their average operating temperatures are determined and resulting performance obtained through simulation.

Indexing terms:

• Integrated circuits
• VLSI
• Thermal modelling