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Letters to the Editor

Development of Gold Plating Techniques for Integral Heat Sink of IMPATT Diodes

, AMIETE, , AMIETE & , FIETE
Pages 391-392 | Published online: 02 Jun 2015
 

Abstract

An experimental study for electrodeposition of gold metal on the silicon wafer for the formation of an integral heat sink of IMPATT diodes is presented in this paper. The rate of deposition is 5.0 microns/hr to 8.0 microns/hr with optimized plating parameters.

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