Low Cost, Indigenous, Ultra-Thin HTSC Film Deposition Technique for Device Applications

Abstract

Low-cost, indigenous, HTSC ultra thin film fabrication technique has been demonstrated. The technique makes use of a simple idea of conversion of a thin layer of copper deficient non-superconducting ‘123’ substrate in to a superconducting phase by copper doping. It gives films of thickness around 20nm and T_c of 92.88K. The XRD patterns of the substrate show the formation of 123 phase in the substrate even with sufficient copper deficiencies. The intensities of peaks which corresponds to ‘123’ phase have found to increase after copper doping.

Indexing terms:

• HTSC
• Ultra-thin films
• Solid-state reaction
• Diffusion
• Doping

Additional information

Notes on contributors

S A Mirji

S A Mirji, was born in the year 1962. Obtained his BSc from Karnataka University-Dharwad in 1983, MSc degree in Physics from Mangalore University-Mangalore in 1985 and PhD degree from NT-Bombay in 1993. From March 1990 onwards he is working as a Scientist in the Central Electronics Engineering Research Institute, Pilani (Rajasthan). He has been a visiting Scientists at Max-Planck-Institute für Festkörperforschung-Stuttgart, Germany. His interests include-High temperatures superconductors-material fabrication & charactrisation, High heat flux heat sinks for high power semiconductor laser diode array packaging. He is a life member of Indian Physics Assocation.