Design and Development of Dielectric based Electrostatic Microactuators

Abstract

Silicon micromachining has become a fundamental tool for the realization of micro-electromechanical devices. In the work presented here silicon dioxide based cantilevers are used as the basis for the development of the electrostatic microactuators. Direct wafer bonding technology has been utilized for the formation of the microactuators. The fabrication of cantilever beam microactuators has been accomplished. The complete design and fabrication feasibilities of the dielectric based electrostatic microswitch using direct wafer bonding have been proposed. The optimization of the various fabrication processes for these microactuators has been reported in this paper.

Indexing terms:

• Electrostatic microactuators
• Cantilever beam
• Direct wafer bonding technology
• Dielectrics
• Microfabrication processes

Additional information

Notes on contributors

Rajeevan Chandel

Rajeevan Chandel, a double Gold Medallist of HPU, Shimla, got her BE Degree in Electronics and Communication Engineering from TIET, Patiala in 1990. She did her MTech in Integrated Electronics and Circuits from IIT, Delhi. Her fields of interest are Electronic simulation, VLSI design and technology. She is woking as a Senior Lecturer in E&CED, REC, Hamirpur, HP.

Ashwani Kumar

Ashwani Kumar, is working as a Senior Lecturer in Electrical Engineering Department, Regional Engineering College, Hamirpur, Himachal Pradesh. He got his BTech Degree from Kerala University in 1987. He did his Master's Degree from PEC, Chandigarh in 1990.