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Abstract
The transmission-line-matrix (TLM) numerical time-domain method using the symmetrical super-condensed node (SSCN) is applied to calculate the cross-talk time & frequency-response between tracks on a double-sided vertical-PCB-on-backplane configuration over a frequency range of 50 MHz to 1GHz. Meshing was done on a layer-wise basis which consisted of dividing the entire computational region into groups-of-vertical-layers in the XY plane, with each group of layers having the same mesh pattern. Extensive use was made of a recently introduced one and two dimensional multi-gridding technique to keep the total mesh count to a reasonable value. Perfectly-matched-layer absorbing boundary conditions were used and simulation was done for six PCB configurations for 100,000 time-steps, the time-step being 0.523 ps for a spatial resolution of 0.3175 mm. Simulation results compare well with the experimental data over the frequency range of interest.
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G N Mulay
G N Mulay received the BTech and MTech degrees in electrical engineering from the Indian Institute of Technology, Bombay in 1977 and 1979, respectively. From 1979 to 1982, he worked in the Control & Relay division of ASEA (now ABB) at Mumbai as an Application Engineer. In 1983, he joined the Industrial Electronics division of Philips at their factory at Pune and worked in the Development Laboratory on industrial controllers and switching power supplies.
In 1993, he joined the Maharashtra Institute of Technology, Pune and is now a Professor in the Electronics & Telecommunications Department. He has recently submitted his PhD thesis to the University of Pune. His interests include power electronic drives and modelling of electromagnetic interference problems.