Drying-Induced Cracks in Thin Film Fabricated from Colloidal Dispersions

Abstract

As a colloidal dispersion is coated and dried on a nonporous rigid substrate, the enormous stresses developing during the drying process can fracture the thin film. The drying-induced cracks can produce serous technological consequences and even destroy the efficacy of coatings, which is not desirable in most industrial cases. Therefore, as the first step of controlling cracks in thin film, understanding of crack properties and cracking mechanisms leading to fracture is of vital significance. Although numerous experiments and models have been proposed for cracking during drying of colloidal dispersions, there is little consensus on even the most basic mechanisms, and the effect of heat transfer on cracks as well as optimization of drying process are rarely taken into account. Additional, the broad employments of nanosuspensions bring both opportunities and challenges for this area. This review will give a comprehensive physical picture of thin film fabrication by drying of colloidal dispersions and cracking phenomenon, present current investigations for drying-induced cracks, and point out some prospects for cracking researches especially for industrial R&D, as well as propose combination of thin film preparation with drying technique for exploring crack-free thin film.

Keywords:

• Colloidal dispersion
• Crack-free
• Drying-induced crack
• Nanosuspension
• Ring-like deposit
• Thin film

ACKNOWLEDGEMENTS

This work was jointly supported by the National Natural Science Foundation of China through grant number 10572052 and the Foundation for Study Abroad of Education of Ministry of China. Partial support of M3TC at NUS is acknowledged.